Heat Dissipating device

ABSTRACT

A heat dissipating device includes a casing having a compartment. At least one heat conducting board is mounted in the compartment and divides the compartment into first and second chambers. The first chamber includes a plurality of openings. At least one fan unit is mounted in the first chamber and includes at least one air inlet and at least one air outlet. The air inlet is in communication with a first one of the plurality of openings. The air outlet is in communication with a second one of the plurality of openings. By utilizing the heat conducting board to absorb the heat generated by electronic elements in the second chamber and by creating airflow in the first chamber with the fan unit, the temperature of the second chamber and the electronic elements is lowered while preventing moisture or dust from entering the first chamber.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat dissipating device and, more particularly, to a heat dissipating device that can operate without adverse affect by moisture, dust, etc.

2. Description of the Related Art

Electronic elements, such as microprocessors, chips, etc., of most electronic products are generally concentrated and mounted in a casing. However, the temperature in a generally sealed inner chamber of the casing rises more rapidly as the functions and operating speed of the electronic elements upgrade. Heat dissipating devices, such as fans or heat sinks, are provided to dissipate heat to maintain normal operation of the electronic elements at an appropriate temperature and to prolong the service lives of the electronic elements.

FIGS. 1 and 2 show a conventional heat dissipating device including a casing 7 and two fan units 8. Specifically, the casing 7 includes a compartment 71 receiving a plurality of electronic elements 9. The casing 7 further includes two openings 72 respectively in a top side and one of four sides of the casing 7. Each fan unit 8 is mounted in one of the openings 72. The electronic elements 9 generate heat during operation, causing a rise in a temperature in the compartment 71. One of the fan units 8 draws ambient air at room temperature into the compartment 71 for heat exchange with the electronic elements 9. The other fan unit 8 expels the hot air after heat exchange out of the compartment 71, dissipating heat out of the compartment 71 and enhancing an overall heat dissipating effect in the casing 7. However, moisture, dust, etc. contained in the ambient air enters the compartment 71 together with the air, moistening the electronic elements 9 and causing short circuit or even damage to the electronic elements 9. The service life of the electronic product using the electronic elements 9 is, thus, shortened.

SUMMARY OF THE INVENTION

An objective of the present invention is to provide a heat dissipating device that can operate without adverse affect by moisture, dust, etc, prolonging the service lives of electronic elements.

Another objective of the present invention is to provide a heat dissipating device that transfers the heat generated by the electronic elements to a chamber for heat dissipation purposes.

A further objective of the present invention is to provide a heat dissipating device that provides a heat conducting board to increase a heat exchange area with the electronic elements for enhancing the overall heat dissipating efficiency.

The present invention fulfills the above objectives by providing, in a preferred form, a heat dissipating device including a casing having a compartment. At least one heat conducting board is mounted in the compartment and divides the compartment into a first chamber and a second chamber with the at least one heat conducting board located between the first and second chambers. The first chamber includes a plurality of openings. At least one fan unit is mounted in the first chamber. The at least one fan unit includes at least one air inlet and at least one air outlet. The at least one air inlet is aligned and in communication with a first one of the plurality of openings. The at least one air outlet is aligned and in communication with a second one of the plurality of openings.

By utilizing the heat conducting board to absorb the heat generated by the electronic elements in the second chamber and by creating airflow in the first chamber with the fan unit, the temperature of the second chamber and the electronic elements is lowered. Furthermore, the electronic elements will not be moistened or contaminated by moisture, dust, or the like, prolonging the service life and enhancing stability of an electronic product utilizing the electronic elements.

The present invention will become clearer in light of the following detailed description of illustrative embodiments of this invention described in connection with the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The illustrative embodiments may best be described by reference to the accompanying drawings where:

FIG. 1 shows a perspective view of a conventional heat dissipating device.

FIG. 2 shows a cross sectional view of the heat dissipating device of FIG. 1 according to section line 2-2 of FIG. 1.

FIG. 3 shows an exploded, perspective view of a heat dissipating device of a first embodiment according to the preferred teachings of the present invention.

FIG. 4 shows a top view of the heat dissipating device of FIG. 3.

FIG. 5 shows a cross sectional view of the heat dissipating device of FIG. 3 according to section line 5-5 of FIG. 4.

FIG. 6 shows an exploded, perspective view of a heat dissipating device of a second embodiment according to the preferred teachings of the present invention.

FIG. 7 shows a top view of the heat dissipating device of FIG. 6.

FIG. 8 shows a cross sectional view of the heat dissipating device of FIG. 6 according to section line 8-8 of FIG. 7.

FIG. 9 shows an exploded, perspective view of a heat dissipating device of a third embodiment according to the preferred teachings of the present invention.

FIG. 10 shows a top view of the heat dissipating device of FIG. 9.

All figures are drawn for ease of explanation of the basic teachings of the present invention only; the extensions of the figures with respect to number, position, relationship, and dimensions of the parts to form the preferred embodiments will be explained or will be within the skill of the art after the following teachings of the present invention have been read and understood. Further, the exact dimensions and dimensional proportions to conform to specific force, weight, strength, and similar requirements will likewise be within the skill of the art after the following teachings of the present invention have been read and understood.

Where used in the various figures of the drawings, the same numerals designate the same or similar parts. Furthermore, when the terms “first”, “second”, “third”, “fourth”, “lower”, “upper”, “side”, “end”, and similar terms are used herein, it should be understood that these terms have reference only to the structure shown in the drawings as it would appear to a person viewing the drawings and are utilized only to facilitate describing the invention.

DETAILED DESCRIPTION OF THE INVENTION

A heat dissipating device of a first embodiment according to the preferred teachings of the present invention is shown in FIGS. 3-5. The heat dissipating device is utilized to dissipate heat generated by a plurality of electronic elements 9 mounted in a casing of an electronic product such as a camera, electronic digital displayer, notebook, satellite navigation device, etc. The heat dissipating device includes a casing 1, at least one heat conducting board 2, and at least one fan unit 3. The casing 1 includes a compartment 11. The at least one heat conducting board 2 is integrally formed or detachably mounted in the compartment 11, dividing the compartment 11 into a first chamber receiving the at least one fan unit 3 and a second chamber receiving the electronic elements 9 such as circuit boards, microprocessors, chips, etc. The at least one heat conducting board 2 is made of metal with excellent heat conduction characteristics, such as aluminum, copper, gold, silver, or an alloy thereof.

In the first embodiment, the heat dissipating device includes only one heat conducting board 2 that separates the compartment 11 into a first chamber 111 and a second chamber 112 between which the heat conducting board 2 is located. The first chamber 111 defines a first air channel 111 a. Furthermore, the first chamber 111 includes a plurality of openings. In the first embodiment, the first chamber 111 includes a first opening 1111 in an end of the first air channel 111 a and a second opening 1112 in the other end of the first air channel 111 a.

The at least one fan unit 3 is mounted in the first chamber 111 and can be of axial-flow type or blower type. In the first embodiment, the heat dissipating device includes first and second fan units 3 a and 3 b of axial-flow type. The first and second fan units 3 a and 3 b are respectively mounted in the ends of the first air channel 111 a. Each of the first and second fan units 3 a and 3 b includes an air inlet 31 and an air outlet 32. The air inlet 31 of the first fan unit 3 a is aligned and in communication with the first opening 1111. The air outlet 32 of the second fan unit 3 b is aligned and in communication with the second opening 1112.

With reference to FIGS. 3-5, in use of the heat dissipating device of the first embodiment according to the teachings of the present invention, the electronic elements 9 of the electronic product is mounted in the second chamber 112 of the casing 1. Some of the electronic elements 9 can be in direct contact with a side of the heat conducting board 2. Other electronic elements 9 can be connected by one or more heat pipes H or the like to the heat conducting board 2.

The electronic elements 9 generate heat during operation, leading to an increase in the temperature in the second chamber 112. The heat conducting board 2 absorbs the heat generated by the electronic elements 9 in direct contact with the side of the heat conducting board 2 and absorbs the heat generated by the other electronic elements 9 via the heat pipes H. Thus, the temperature of the heat conducting board 2 rises. At the same time, the first fan unit 3 a draws in ambient air at room temperature via the first opening 1111 and the air inlet 31 of the first fan unit 3 a. The air at room temperature is then sent into the first air channel 111 a via the air outlet 32 of the first fan unit 3 a to proceed with heat exchange with the heat conducting board 2 and turns into hot air, thereby lowering the temperature of the heat conducting board 2. The hot air after heat exchange is drawn into the air inlet 31 of the second fan unit 3 b and then expelled to the outside via the air outlet 32 of the second fan unit 3 b. Continuous airflow can be created in the first air channel 111 a for dissipating heat of the heat conducting board 2.

According to the teachings of the present invention, by utilizing the side of the heat conducting board 2 to absorb the heat generated by the electronic elements 9 in the second chamber 112 and by creating airflow in the first chamber 111 at the other side of the heat conducting board 2 with the fan unit 3, the temperature of the second chamber 112 and the electronic elements 9 is lowered. Furthermore, since the first and second chambers 111 and 112 are independent from each other, the first chamber 111 can be in communication with or not in communication with the second chamber 112. In the first embodiment, the first chamber 111 is not in communication with the second chamber 112. Thus, the moisture, dust, or the like contained in the ambient air and drawn by the fan unit 3 into the first chamber 111 together with the air will not enter the second chamber 112. Thus, the electronic elements 9 will not be moistened or contaminated by the moisture, dust, or the like, avoiding short circuit of the electronic elements 9 and prolonging the service life and enhancing stability of the electronic product.

Furthermore, since the electronic elements 9 can be either directly bonded to or indirectly coupled by heat pipes H to the heat conducting board 2, the heat generated by the electronic elements 9 can be more directly and rapidly transferred to the heat conducting board 2 for heat dissipation purposes. The overall heat dissipating effect of the heat dissipating device according to the teachings of the present invention is, thus, enhanced.

FIGS. 6-8 show a heat dissipating device of a second embodiment according to the preferred teachings of the present invention. Compared to the first embodiment, the first chamber 111 of the heat dissipating device of the second embodiment includes first, second, and third openings 1111, 1112, and 1113. The first opening 1111 is in an end of the first air channel 111 a, the second opening 1112 is in the other end of the first air channel 111 a, and the third opening 1113 is in a side (the top side in the preferred form shown) of the first chamber 111 and in communication with the first air channel 111 a. Furthermore, the fan unit 3 is mounted into the first air channel 111 a via the second opening 1112.

With reference to FIGS. 6-8, a plurality of fins 21 is mounted to a side of the heat conducting board 2. The fins 21 are parallel to each other and located in the first air channel 111 a. Furthermore, each fin 21 extends from the first opening 1111 towards but spaced from the second opening 1112. The fan unit 3 is of blower type and includes an air inlet 31 and an air outlet 32. The air inlet 31 is aligned and in communication with the third opening 1113. The air outlet 32 is aligned and in communication with the first opening 1111.

In this embodiment, by utilizing the side of the heat conducting board 2 to absorb the heat generated by the electronic elements 9 in the second chamber 112 and by drawing air at room temperature into the first air channel 111 a with the fan unit 3 to dissipate heat from the heat conducting board 2 and the fins 21, the temperature of the heat conducting board 2 is lowered, because the heat accumulated in the heat conducting board 2 and the fins 21 is carried away by the air. After heat exchange, the hot air is expelled to the outside via the first air opening 1111. Thus, the temperature of the second chamber 112 and the electronic elements 9 in the second chamber 112 can be effectively lowered while prolonging the service life and enhancing stability of the electronic product by preventing the moisture, dust, or the like from entering the second chamber 112.

FIGS. 9 and 10 show a heat dissipating device of a third embodiment according to the preferred teachings of the present invention. Compared to the second embodiment, the heat dissipating device of the third embodiment includes two heat conducting boards 2 to separate the compartment 11 into a first chamber 111 and a second chamber 112. The first chamber 111 is substantially L-shaped in cross section and includes a first air channel 111 a and a second air channel 111 b in communication with the first air channel 111 a. An intersection of the first and second air channels 111 a and 111 b forms a mounting area T in which the fan unit 3 is mounted. The first chamber 111 includes first, second, third, and fourth openings 1111, 1112, 1113, and 1114. The first opening 1111 is located in an end of the first air channel 111 a, and the second opening 1112 is located in an end of the second air channel 111 b. The third opening 1113 is located in a top side of the mounting area T, and the fourth opening 1114 is located in a bottom side of the mounting area T. The fan unit 3 can be mounted into the mounting area T via the third opening 1113.

The fan unit 3 includes a first air inlet 31 a, a second air inlet 31 b, a first air outlet 32 a, and a second air outlet 32 b. When the fan unit 3 is mounted in the mounting area T, the first air inlet 31 a is aligned and in communication with the third opening 1113, the second air inlet 31 b is aligned and in communication with the fourth opening 1114, the first air outlet 32 a is in communication with the first opening 1111 via first air channel 111 a, and the second air outlet 32 b is in communication with the second opening 1112 via the second air channel 111 b.

In this embodiment, by utilizing the heat conducting boards 2 to absorb the heat generated by the electronic elements 9 in the second chamber 112 and by drawing air at room temperature into the first and air channels 111 a and 111 b with the fan unit 3 via the first and second air inlets 31 a and 31 b to dissipate heat from the heat conducting boards 2, the temperature of the heat conducting boards 2 is lowered, because the heat accumulated in the heat conducting boards 2 is carried away by the air. After heat exchange, the hot air is expelled to the outside via the first and second openings 1111 and 1112. Thus, the temperature of the second chamber 112 and the electronic elements 9 in the second chamber 112 can be effectively lowered while prolonging the service life and enhancing stability of the electronic product by preventing the moisture, dust, or the like from entering the second chamber 112.

Furthermore, the heat exchange area between the heat conducting boards 2 and the second chamber 112 as well as the electronic elements 9 is largely increased while the fan unit 3 drives air to flow through the first and second air channels 111 a and 111 b for dissipating heat from the heat conducting boards 2, enhancing the overall heat dissipating efficiency and maintaining a stable operating temperature for the electronic elements 9.

Thus since the invention disclosed herein may be embodied in other specific forms without departing from the spirit or general characteristics thereof, some of which forms have been indicated, the embodiments described herein are to be considered in all respects illustrative and not restrictive. The scope of the invention is to be indicated by the appended claims, rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are intended to be embraced therein. 

1. A heat dissipating device comprising: a casing including a compartment; at least one heat conducting board mounted in the compartment and dividing the compartment into a first chamber and a second chamber with said at least one heat conducting board located between the first and second chambers, with the first chamber including a plurality of openings; and at least one fan unit mounted in the first chamber, with said at least one fan unit including at least one air inlet and at least one air outlet, with said at least one air inlet aligned and in communication with a first one of the plurality of openings, with said at least one air outlet aligned and in communication with a second one of the plurality of openings.
 2. The heat dissipating device as claimed in claim 1, with the first chamber and the second chamber being not in communication with each other.
 3. The heat dissipating device as claimed in claim 1, with the plurality of openings including first and second openings, with the first chamber defining an air channel, with the air channel including first and second ends respectively in communication with the first and second openings.
 4. The heat dissipating device as claimed in claim 3, with said at least one fan unit including first and second fan units each having an air inlet and an air outlet, with the air inlet of the first fan unit aligned and in communication with the first opening, and with the air outlet of the second fan unit aligned and in communication with the second opening.
 5. The heat dissipating device as claimed in claim 1, with the plurality of openings including first, second, and third openings, with the first chamber defining an air channel having first and second ends respectively in communication with the first and second openings, with the third opening formed in a side of the first chamber and in communication with the air channel.
 6. The heat dissipating device as claimed in claim 5, with the fan unit including an air inlet and an air outlet, with the air inlet aligned and in communication with the third opening, and with the air outlet aligned and in communication with the first opening via the air channel.
 7. The heat dissipating device as claimed in claim 1, with the first chamber including a first air channel and a second air channel in communication with the first air channel.
 8. The heat dissipating device as claimed in claim 7, with the with the plurality of first and second openings, with the first opening located in an end of the first air channel, with the second opening located in an end of the second air channel.
 9. The heat dissipating device as claimed in claim 8, with the first and second air channels having an intersection forming a mounting section, and with the fan unit mounted in the mounting section.
 10. The heat dissipating device as claimed in claim 9, with the plurality of openings further including third and fourth openings, with the third opening located in a top side of the mounting area, and with the fourth opening located in a bottom side of the mounting area.
 11. The heat dissipating device as claimed in claim 10, with the fan unit including a first air inlet, a second air inlet, a first air outlet, and a second air outlet, with the first air inlet aligned and in communication with the third opening, with the second air inlet aligned and in communication with the fourth opening, with the first air outlet in communication with the first opening via the first air channel, and with the second air outlet in communication with the second opening via the second air channel.
 12. The heat dissipating device as claimed in claim 1, with said at least one heat conducting board integrally formed in the compartment of the casing.
 13. The heat dissipating device as claimed in claim 1, with said at least one heat conducting board detachably mounted in the compartment of the casing.
 14. The heat dissipating device as claimed in claim 3, with said at least one heat conducting board including a plurality of fins, with the plurality of fins parallel to each other and located in the air channel, and with each of the plurality of fins extending from the first opening towards but spaced from the second opening.
 15. The heat dissipating device as claimed in claim 5, with said at least one heat conducting board including a plurality of fins, with the plurality of fins parallel to each other and located in the air channel, and with each of the plurality of fins extending from the first opening towards but spaced from the second opening.
 16. The heat dissipating device as claimed in claim 7, with said at least one heat conducting board including a plurality of fins, with the plurality of fins parallel to each other and located in the air channel. 